Proceedings of 8th International Conference on Tangible, Embedded and Embodied Interaction (TEI'2014)

Butz, A., Greenberg, S., Bakker, S., Loke, L. and De Luca, A. (2014)
Proceedings of 8th International Conference on Tangible, Embedded and Embodied Interaction (TEI'2014). ACM Press, Conference held at Munich, Germany, February 16-19. PDF is of the front matter (Cover, Committees, Reviewers, Preface, Keynotes, Contents). See URL for a link to the actual articles available via the ACM Digital Library.

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Abstract

The work presented at ACM TEI has a strong focus on how computing can bridge atoms, bits and our surrounding everyday environment into cohesive interactive systems. What is surprising is that this focus was considered quite esoteric in 2007, the date of the first TEI conference. This has changed remarkably quickly. Creating such interactive systems has become easier through advances in materials, 3d printing, easy-to-program microcomputers, high-quality sensors and actuators, and specialized toolkits. More importantly, our culture has changed its perspective, where people no longer consider it unusual for computation to be embedded in our environment, surroundings, and everyday objects.

Bibtex entry

@BOOK { 2014-TEIConference.ACM,
CLASS = { BOOK },
AUTHOR = { Butz, A. and Greenberg, S. and Bakker, S. and Loke, L. and De Luca, A. },
TITLE = { Proceedings of 8th International Conference on Tangible, Embedded and Embodied Interaction (TEI'2014) },
PUBLISHER = { ACM Press },
ADDRESS = { Conference held at Munich, Germany },
YEAR = { 2014 },
MONTH = { February 16-19 },
DOI = { http://dl.acm.org/citation.cfm?id=2540930&picked=prox&CFID=300698344&CFTOKEN=76017027 },
NOTE = { PDF is of the front matter (Cover, Committees, Reviewers, Preface, Keynotes, Contents). See URL for a link to the actual articles available via the ACM Digital Library },
}